Resumé

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Eduction

M.S. Mechanical Engineering Mechatronics & Design
Stanford University - GPA 3.8
SEP 2021 - JUN 2023

B.S. Mechanical Engineering
University of Colorado Boulder - GPA 3.9 magna cum laude
AUG 2016 - MAY 2020

Experience

Course Assistant for Mechanical Systems Design | Stanford University
Taught design principles including system modeling, failure modes, FBDs, inverse failure analysis, FEA, mass optimization, DC motor modeling and operating point selection, gearing, energy losses, and power efficiency
JAN 2022 – JUN 2023

Field Reliability Intern | Rivian Automotive
Researched and implemented data-driven diagnostics and prognostics for field failures and root cause analysis
JUL 2022 - SEP 2022

Threshold Ventures Fellow | Stanford Technology Ventures Program
Weekly discussion on entrepreneurship, VC, ethics, leadership, & more, led by amazing mentors from the venture world
JAN 2022 – MAY 2022

Spacecraft Test Engineer | Redwire Space
Designed production run test campaign, including GSE design, documentation development, and technician training
DEC 2020 – SEP 2021

Spacecraft Manufacture Engineering Intern | SpaceX
Designed and implemented tooling for flight hardware handling and build process automation
MAY 2020 – SEP 2020

CubeSat Program Manager & Design Engineer | NASA Colorado Space Grant
As PM, led team of twenty students in fasted-paced work environment to meet customer and internal milestones
As System Lead, led sub-system integration and test, and pre-flight environmental test campaign effort
As Structures Lead, led team of three in designing and integrating flight components and GSE
DEC 2016 – SEP 2020

Robotics Engineering Intern | Robotic Materials
Explored capabilities of gripper with on-board vision system including demos, grasp optimization, and pick-and-place
FEB 2019 – FEB 2020

Coursework

ME218 Smart Product Design | Stanford University
Electrical and software design for embedded microcontrollers including signal conditioning, state machines, and peripheral control. Quarters culminate in a multi-disciplinary team-based project
SEP 2021 – DEC 2022

EE256 Board Level Design | Stanford University
Practical experience in board-level electrical design, from copper clad prototype boards to 4-layer PCBA design for embedded systems. Additionally, hands-on training in SMD hand and stencil/reflow soldering SEP 2021 – DEC 2022

CS229 Machine Learning | Stanford University
Supervised regression, GLMs, SVMs. Unsupervised Kmeans, PCA. Deep learning and neural networks
SEP 2021 – DEC 2021

MCEN5125 Optimal Design | University of Colorado Boulder
Applications in handwriting recognition, image compression, path planning, structure mass optimization
JAN 2020 – MAY 2020

ASEN4519 Microavionics | University of Colorado Boulder
Embedded software design for high-speed, aerospace (or similar) applications. Experience coding in Assembly and C
JAN 2020 – MAY 2020

Skills

Updated 1/21/2023